The AI Infrastructure Stack
Overview  /  Tier V — Silicon  /  Layer 13: Advanced Packaging
Sub-category 13.6

Test, Burn-In & Probe Cards

Testing each die before and after packaging. AI accelerators have so many I/Os and so much memory that test time per chip has exploded.

Players

Players: Advantest 6857.T, Teradyne TER, Cohu COHU, FormFactor (probe cards) FORM, Technoprobe TPRO.MI, MPI Corp 6223.TW

Analysis coming soon — this page is scaffolding for deeper research into test, burn-in & probe cards.