Sub-category 13.2
OSAT — Outsourced Assembly & Test
The packaging houses that handle the non-leading-edge majority of the world’s chips, plus growing AI-adjacent work.
Players
Players: ASE Technology ASX, Amkor Technology AMKR, JCET 600584.SS, Powertech Technology (PTI) 6239.TW, ChipMOS IMOS, Tongfu Microelectronics 002156.SZ, King Yuan Electronics 2449.TW
Analysis coming soon — this page is scaffolding for deeper research into osat — outsourced assembly & test.