IC Substrates (ABF) for Advanced Packaging

The high-layer-count organic substrate under the package. Capacity-constrained; lead times still 6–12 months.

Players

Players: Unimicron 3037.TW, Ibiden 4062.T, Shinko Electric 6967.T, Semco 009150.KS, AT&S ATS.VI, Kyocera 6971.T, Nan Ya PCB 8046.TW