The AI Infrastructure Stack
Overview  /  Tier V — Silicon  /  Layer 13: Advanced Packaging
Sub-category 13.1

2.5D / 3D Advanced Packaging (CoWoS, SoIC, FOPLP)

The actual packaging step. TSMC dominates the AI accelerator packaging market; Intel and Samsung have alternatives.

Players

Players: TSMC (CoWoS, SoIC) TSM, Samsung (I-Cube, X-Cube) 005930.KS, Intel (Foveros, EMIB) INTC, ASE / SPIL (FOCoS-Bridge) ASX

Analysis coming soon — this page is scaffolding for deeper research into 2.5d / 3d advanced packaging (cowos, soic, foplp).