HBM Stacking & TSV (Through-Silicon Via)

How HBM goes from individual DRAM die to a 12-high stack with thousands of TSVs. Driven by hybrid bonding adoption.

Players

Players: SK Hynix 000660.KS, Samsung 005930.KS, Micron MU, BE Semiconductor (bonders) BESI.AS, ASMPT (bonders) 0522.HK, Hanmi Semiconductor (TC bonders) 042700.KS, Kulicke & Soffa KLIC