Advanced Packaging Equipment

The tools that perform bonding, dicing, molding, plating for advanced packages. The hybrid-bonder market is a real new growth pool.

Players

Players: BE Semiconductor (hybrid bonders) BESI.AS, ASMPT 0522.HK, Applied Materials (hybrid bonding) AMAT, Kulicke & Soffa KLIC, Disco Corp (dicing/grinding) 6146.T, Tokyo Electron 8035.T, SCREEN Holdings 7735.T, Towa Corp (molding) 6315.T