The AI Infrastructure Stack
Overview  /  Tier V — Silicon  /  Layer 14: Semiconductor Equipment (Semicap)
Sub-category 14.2

DUV Lithography (193nm immersion + older)

Trailing-edge and back-end-of-line lithography. ASML dominant but Nikon/Canon serve mature nodes.

Players

Players: ASML ASML, Nikon 7731.T, Canon (incl. nanoimprint) 7751.T, SMEE (Shanghai Micro Electronics) Private

Analysis coming soon — this page is scaffolding for deeper research into duv lithography (193nm immersion + older).