IC Substrates & High-End PCBs

The interposers and boards under the silicon. Tight capacity for ABF substrates feeds CoWoS bottleneck.

Players

Players: Unimicron 3037.TW, Ibiden 4062.T, Shinko Electric 6967.T, Semco (Samsung Electro-Mechanics) 009150.KS, AT&S ATS.VI, Kyocera 6971.T, Nan Ya PCB 8046.TW, Zhen Ding 4958.TW