The AI Infrastructure Stack
Overview  /  Tier III Physical Data Center  /  Layer 06: Data Center Facility Systems
Sub-category 6.2

Liquid Cooling — Direct-to-Chip (CDUs, cold plates, manifolds)

The dominant approach for Blackwell-class racks. The single highest-growth sub-category in this layer.

Players

Players: Vertiv (CoolTera, custom CDUs) VRT, CoolIT Systems KKR, Motivair SMCI (acquired), Boyd Goldman, Asetek ASTK.OL, ZutaCore Private, JetCool Private, Chilldyne Private, nVent (Schroff) NVT, Delta Electronics 2308.TW, Kelvion Private

Analysis coming soon — this page is scaffolding for deeper research into liquid cooling — direct-to-chip (cdus, cold plates, manifolds).